TPM2.0 TSS (Software Stack) consists of API layers provided to support
TPM 2.0 chips. It is made out of three layers:
.
- Enhanced System API (ESAPI)
- System API (SAPI), which implements the system layer API;
- Marshaling/Unmarshaling (MU)
- TPM Command Transmission Interface (TCTI), which is used by SAPI to
allow communication with the TAB/RM layer;
.
This package contains the udev files
Installed Size: 32.8 kB
Architectures: all